JPH023626Y2 - - Google Patents
Info
- Publication number
- JPH023626Y2 JPH023626Y2 JP137484U JP137484U JPH023626Y2 JP H023626 Y2 JPH023626 Y2 JP H023626Y2 JP 137484 U JP137484 U JP 137484U JP 137484 U JP137484 U JP 137484U JP H023626 Y2 JPH023626 Y2 JP H023626Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor
- semiconductor device
- lead
- semiconductor pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000008188 pellet Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP137484U JPS60113637U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP137484U JPS60113637U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60113637U JPS60113637U (ja) | 1985-08-01 |
| JPH023626Y2 true JPH023626Y2 (en]) | 1990-01-29 |
Family
ID=30474060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP137484U Granted JPS60113637U (ja) | 1984-01-09 | 1984-01-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60113637U (en]) |
-
1984
- 1984-01-09 JP JP137484U patent/JPS60113637U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60113637U (ja) | 1985-08-01 |
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